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Laser marking machine equipment

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Laser marking machine equipment


Main technical parameters:
Power input requirements: 110-220 50/60HZ
Equipment power consumption:<1000W
Machine material and weight: aluminum alloy, 30KG
Laser power: 30W, air-cooled, life ≥ 45000 hours
Control system: embedded Linux system, touch screen control
External interface: I/O, USB, serial port, network port
Marking range: 75mm * 75mm, optional maximum range 600mm * 600mm
Marking speed: ≤ 18000mm /s
Repeat precision (RMS): <2 urad

laser marking machine:
It is to use a laser beam to make permanent marks on the surface of various substances. The effect of marking is to expose deep substances through the evaporation of surface substances, or to "carve" traces through the chemical and physical changes of surface substances caused by light energy, or to burn off some substances through light energy to display the graphics and characters to be etched.

CO2 laser machine characteristic application:
Wavelength of 10.6μm vs. 9.3μm on PET

 

 

Wavelength of 10.2μm and 10.6μm in coated paper

C- 3000 series laser machine applicable material:
Paper products, labels, wood products, glass, PET, plastic products, ceramics, leather, cloth, coated metal products, etc.
Widely used:
Wine, water, beverages, grain and oil, medicine, daily chemicals, ceramics, toys and many other fields.

 

Optical Fiber Technology 1064nm

fiber laser machine application:
Cans, paper products, metal, plastic, rubber, glass, flexible packaging film and other materials.
Widely used: building materials, auto parts, hardware and electronics, medicine, soft bag food, daily chemical, mechanical processing, aerospace and other fields.

UV laser marking technology
Laser marking machine using ultraviolet laser, compared with infrared laser, ultraviolet light focus spot is very small, can greatly reduce the mechanical deformation of the material and processing heat effect is small, belongs to the cold processing.
"Cold working" (ultraviolet) photons with high load energy can break chemical bonds in materials (especially organic materials) or surrounding media, cold peeling, and color difference changes in materials. The side effect of "heat damage" in the processing area is minimal. Suitable for fine processing, high clean processing should be.

Schematic diagram of molecular chemical bonds

Schematic diagram of chemical bond breakage

Schematic diagram of molecular fission

UV laser machine application:
Bottles, cans, paper products, metals, composite films, glass, polymer materials, high-density synthetic materials, PE/PET/PS and other materials.
Widely used: beverage, dairy products, hardware and electronics, chip industry, medicine, building materials, daily chemical, aerospace and other fields.